湖北芯擎科技有限公司

Position Description:

The position will be a member of Android SW team for SOC SW release development. The position is expected to have experience with embedded software development, such as android HAL and Android framework development in automotive infotainment, home entertainment or mobile device domain. 

The candidate is also expected to be experienced with at least 2 out of the 3 following programming languages: C/C++/Java.

The candidate is preferred to be familiar with popular android development & debug tools, including Git, Jenkins, Jira, ADB and so on.

This position will be in SiEngine’s Shanghai/Wuhan office.

Required Skills:

- 2-10 years of software development with embedded system.

- Successful project experience with C, C++ or Java programming.

- At least, Production proven skills in one of the following Android SW area:

n  Audio – audio flinger， audio policy， audio path, audio multiple devices support

n  Automotive – Car service, Vehicle HAL, etc

n  Camera – Multiple camera experience is plus

n  Connectivity - especially WiFi module

n  Graphics – surface flinger、OpenGL ES or Vulkan, HW composer, Multiple display, etc

n  Interaction - key/Touching input, NN API，Peripherals， Sensors

n  Media – OpenMAX, Android media player, etc

n  Storage，Android OTA， Android boot optimization，

- Linux Kernel space and user space driver development skills is a plus.

- Android APP and APP framework development skills is a plus. Android CM experience is a plus.

- NN deep learning algorithm development or SW deployment experience is a plus.

Education Requirement:

Bachelor’s degree and above from top universities, Major in EE, CS or related subjects.   Master’s degree and above, from 211, 985 universities, is a plus.

Position Description:

The position will be a member of Android SW team for SOC SW release development. The position is expected to have experience with embedded software development, such as android HAL and Android framework development in automotive infotainment, home entertainment or mobile device domain. 

The candidate is also expected to be experienced with at least 2 out of the 3 following programming languages: C/C++/Java.

The candidate is preferred to be familiar with popular android development & debug tools, including Git, Jenkins, Jira, ADB and so on.

This position will be in SiEngine’s Shanghai/Wuhan office.

Required Skills:

-  2-10 years of software development with embedded system.

-  Successful project experience with C, C++ or Java programming.

-  At least, Production proven skills in one of the following Android SW area:

n  Audio – audio flinger， audio policy， audio path, audio multiple devices support

n  Automotive – Car service, Vehicle HAL, etc

n  Camera – Multiple camera experience is plus

n  Connectivity - especially WiFi module

n  Graphics – surface flinger、OpenGL ES or Vulkan, HW composer, Multiple display, etc

n  Interaction - key/Touching input, NN API，Peripherals， Sensors

n  Media – OpenMAX, Android media player, etc

n  Storage，Android OTA， Android boot optimization，

-   Linux Kernel space and user space driver development skills is a plus.

-   Android APP and APP framework development skills is a plus. Android CM experience is a plus.

-   NN deep learning algorithm development or SW deployment experience is a plus.

Education Requirement:

Bachelor’s degree and above from top universities, Major in EE, CS or related subjects.   Master’s degree and above, from 211, 985 universities, is a plus.

Job Description：

该职位负责芯擎汽车类芯片（下一代智能驾驶芯片，智能座舱芯片，高性能车规微处理器等）SOC架构设计。

1、 根据车规芯片产品规格定义SOC芯片架构以及模块微架构设计。

2、 负责芯片架构层面的PPA优化。

3、 负责分析业务特点，推动软硬件协同设

4、 负责系统性能测试和竞争性分析。

5、 负责解决芯片设计实现过程中的技术问题，确保关键规格的达成

计算机，电子工程、微电子或相关专业，硕士及以上学历

熟悉基于ARM处理器的SOC架构，熟悉总线、DDR、PCIe控制器以及各种标准外设接口，熟悉SOC前后端开发流程，熟悉性能和功耗评估；

 7年以上SOC开发经验，2年以上架构设计经验

 熟悉Verilog和C语言，了解VMM/OVM/UVM验证方法学

 熟悉Linux操作系统和Synopsys/Cadence/Mentor各种前端设计EDA工具如Spyglass, DC, PT, VCS等。

具备软硬件联合开发调试经验者优先考虑

有汽车类芯片SOC整合设计或架构设计经验者优先考虑。

良好的应用能力、沟通能力和团队精神

Job Description：

该职位负责芯擎汽车类芯片（下一代智能驾驶芯片，智能座舱芯片，高性能车规微处理器等）SOC架构设计。

1、 根据车规芯片产品规格定义SOC芯片架构以及模块微架构设计。

2、 负责芯片架构层面的PPA优化。

3、 负责分析业务特点，推动软硬件协同设

4、 负责系统性能测试和竞争性分析。

5、 负责解决芯片设计实现过程中的技术问题，确保关键规格的达成

计算机，电子工程、微电子或相关专业，硕士及以上学历

熟悉基于ARM处理器的SOC架构，熟悉总线、DDR、PCIe控制器以及各种标准外设接口，熟悉SOC前后端开发流程，熟悉性能和功耗评估；

 7年以上SOC开发经验，2年以上架构设计经验

 熟悉Verilog和C语言，了解VMM/OVM/UVM验证方法学

 熟悉Linux操作系统和Synopsys/Cadence/Mentor各种前端设计EDA工具如Spyglass, DC, PT, VCS等。

具备软硬件联合开发调试经验者优先考虑

有汽车类芯片SOC整合设计或架构设计经验者优先考虑。

良好的应用能力、沟通能力和团队精神

Job Description：

该职位负责芯擎汽车类芯片（下一代智能驾驶芯片，智能座舱芯片，高性能车规微处理器等）SOC架构设计。

1、 根据车规芯片产品规格定义SOC芯片架构以及模块微架构设计。

2、 负责芯片架构层面的PPA优化。

3、 负责分析业务特点，推动软硬件协同设

4、 负责系统性能测试和竞争性分析。

5、 负责解决芯片设计实现过程中的技术问题，确保关键规格的达成

计算机，电子工程、微电子或相关专业，硕士及以上学历

熟悉基于ARM处理器的SOC架构，熟悉总线、DDR、PCIe控制器以及各种标准外设接口，熟悉SOC前后端开发流程，熟悉性能和功耗评估；

 7年以上SOC开发经验，2年以上架构设计经验

 熟悉Verilog和C语言，了解VMM/OVM/UVM验证方法学

 熟悉Linux操作系统和Synopsys/Cadence/Mentor各种前端设计EDA工具如Spyglass, DC, PT, VCS等。

具备软硬件联合开发调试经验者优先考虑

有汽车类芯片SOC整合设计或架构设计经验者优先考虑。

良好的应用能力、沟通能力和团队精神

Job Description:

1. Procurement of technical goods and services including hardware & software, computer peripherals & accessories, telecommunications equipment, cabling,etc. for the company

2. Prepare purchase orders to insure prompt delivery and installation

3. Solicit bids from vendors，Analyze bid proposals and award bids to qualified vendors

4. Sourcing and researching product specifications and alternatives

5. Product returns, invoice discrepancy resolutions

6. Interact with all levels of employee base from employee base to senior management

7. Unassisted development, management & review of key contracting services including vendor research, contract preparation & completion

8. Unassisted execution of key source management services including quarterly vendor reviews, vendor summits and contract dispute management

9. Unassisted development & management of key strategic services including pricing strategies, vendor consolidation & leveraging strategies, insource / outsource strategies, and process design

10. Will manage all purchasing activities of the plant as specified by the director of Purchasing

11. All procurement requirements focus of the cost effective assurance of a consistent and uninterrupted supply of materials that meet or exceed users’ specifications

12. Responsible for obtaining the lowest price available while assuring that quality is of the highest standard

Job Requirements:
Bachelor degree or above, Technical background is preferred.

1. Strong supplier development capability and business negotiation skills.

2. Strong sense of responsibility, be able and willing to work under pressure.

3. Passionate with good team work spirit. Good communication and coordination skills.

4. Proficient in office software; Good English communication skill.

Job Description:

1. 拓展车厂电子电气相关研究部门和汽车零部件系统供应商，了解智能驾舱和自动驾驶的未来规划，帮助提供相关的解决方案。

2. 拓展智能驾舱和自动驾驶整体系统解决方案相关的上下游生态合作伙伴，优化自身方案的性价比，缩短上车量产化的开发时间，提高自己的竞争能力。

3. 拓展除汽车之外的市场，尤其是需要算力和人工智能应用的领域，例如边缘计算/车路协同/工业PC/机器人。

解市场需求，熟悉产业，洞察竞争对手动态。配合产品部门收集市场需求，配合投资部门调研新产品方向。
Job Requirements:

1. 需要汽车行业资深背景，能够直接带来相关客户人脉资源

2. 熟悉上下游产业，协助建立良好的生态系统

3. 客户拓展，沟通能力强，能短期在行业里扩大影响力

4. 有敢打敢拼，吃苦实干的精神，对于困难知难而上

5. 有服务客户的意识，解决客户的痛点，最终构建双赢的局面

6. 有良好的学习能力，对于新市场新产品能积极有效的快速理解并开拓

7. 技术背景，知识面广，熟悉整车电子电器架构，特别是智能驾舱，域控制器，自动驾驶 

8. 对于整个系统相关的领先技术方案有敏锐度，能组合成整个系统的优势

9. 新客户开拓初期的技术交流，能准确理解客户的需求和痛点并解决一些初期的技术问题

10. 对于不同的应用，从电子架构系统角度提出解决方案，同时总结出系统级的优势和性价比

11. 了解和收集自己产品和方案和竞争对手的差异性，给产品部门提供准确的信息输入

Job Description：

1. Procurement of technical goods and services including EDA hardware & software, IP cores, computer peripherals & accessories, testing equipment, etc. for the company 

2. Sourcing and researching product specifications and alternatives 

3. Solicit bids from vendors, analyze bid proposals and award bids to qualified vendors 

4. Prepare purchase orders to insure prompt delivery and installation 

5. Product returns, invoice discrepancy resolutions 

6. Interact with all levels of employee base from employee base to senior management 

7. Unassisted development, management & review of key contracting services including vendor research, contract preparation & completion 

8.  Unassisted execution of key source management services including quarterly vendor reviews, vendor summits and contract dispute management 

9. Unassisted development & management of key strategic services including pricing strategies, vendor consolidation & leveraging strategies, insource / outsource strategies, and process design 

10.  Will manage all purchasing activities of the plant as specified by the director of Purchasing 

11.  All procurement requirements focus of the cost effective assurance of a consistent and uninterrupted supply of materials that meet or exceed users’ specifications 

12. Responsible for obtaining the lowest price available while assuring that quality is of the highest standard
    Job Requirements:

13. Bachelor’s degree or above of technical background,

14. Hands on experience in IC industry. Direct working experience in IC related purchasing, IC design, IC manufacturing are preferred.

15. Strong supplier development capability and business negotiation skills.

16. Strong sense of responsibility, be able and willing to work under pressure.

17. Passionate with good teamwork spirit. Good communication and coordination skills.

18. Proficient in office software; Good English communication skill.

Job Description：

1. In charge of product engineering & yield engineering activities from NPI (New Product Introduction) to MP (mass production).

2. As part of NPI team, by working closely with project manager, design engineers, foundry & subcon, lead PTE teams and ensure on time delivery of all milestone deliverables to meet project development requirements, such as: Post-Si PE plan and execution; DOE design, execution and analysis; Characteristics and Qualification; Programs update and release; Record documentation and management, etc. 

3. As product owner, by working closely with foundry & subcon operations, ensure stable yield with continuous improvement, deliver better-than-target yield; be responsible for RMA, failure analysis and issue debugging; coordinate with foundry, subcon and Quality team on wafer / package related issues; also be responsible for cost reduction, test time reduction, and other tasks assigned by management.

Job Requirements:

1. More than 5 years of product / yield engineering experience with a Master degree or 8+ years’ experience with a bachelor degree. 

2. Hands on product engineering experience in fabless design house is preferred.

3. Direct working experience on FinFET product is a plus. 

4. Good knowledge of IC / SOC development, manufacturing and testing. Good knowledge of ATE test equipment and test program.

5. Demonstrated ability to troubleshoot problems, drive cross-functional groups for fix and improvements.

6. Self-motivated, proven record of delivering results and meeting deadlines under pressure.

7. Good communication and interpersonal skills to work with both internal and external teams.

8. Good oral and written English.